Ultra-Wideband (UWB) technology is experiencing a steep growth in automotive, mobile and IoT markets, based on its secure and precise ranging capabilities. The Digital Key as defined by the Car Connectivity Consortium (CCC) leverages UWB for secure and convenient handsfree car access without compromises. The current-generation NXP Trimension UWB chipsets enable new UWB-radar use cases, such as Child Presence Detection (CPD), kick-sensing for easy trunk access, intrusion or proximity detection, and much more.
These UWB radar applications benefit from advanced target simulation, able to solve technical challenges, like short distance target simulation and large signal bandwidth, to mention just two. The key components are the R&SSMW200A signal generator, a R&SFSW26 spectrum analyzer and an R&S developed control software. The equipment used is available in UWB engineering laboratories hence reducing the initial capital investment. The demonstration is especially interesting for UWB chipset suppliers, module providers, Tier1s and vehicle OEMs.
In order to support the automotive ecosystem in testing these new use cases, collaboration with key partners is especially important. Rohde & Schwarz and NXP Semiconductors have worked closely together to validate this test system. Jürgen Meyer, Vice President Automotive Market Segment at Rohde & Schwarz remarked, “We greatly appreciate the close working relationship with the NXP Semiconductors teams around the world to realize this unique demonstration to provide the automotive industry with the test capabilities it needs to enable the next wave of UWB applications.”
An integral part of this demonstration setup is NXP’s Trimension NCJ29D6A, which is the first monolithic UWB chipset that combines secure ranging and short-range radar with an integrated MCU to enable use cases such as CPD, kick-sensing, and intrusion detection. “The demonstrator from Rohde & Schwarz allows our customers to validate their UWB radar systems and algorithms to shorten development cycles and optimize time-to-market,” said Michael Leitner, General Manager Secure Car Access, NXP Semiconductors. “This collaboration with Rohde & Schwarz is another milestone contributing to the success of UWB technology in the automotive market.”
The test setup will be shown at the Mobile World Congress in Barcelona, from the March 3 to March 6, 2025, at the Fira Gran Via, in Hall 5, booth 5A80.
 technology is experiencing a steep growth in automotive, mobile and IoT markets R&S and NXP Trimension.){kind=link}