AAEON, launched the COM-MTHC6, a COM Express Type 6 Compact Size (95mm x 95mm) with Intel Core Ultra Series Processors and up to 96GB of dual-channel DDR5 system memory running at 5600MHz, available through two SODIMM slots.
The COM-MTHC6 is the first of AAEON’s Computer-on-Modules to utilize the new Intel platform, as well as being the world’s only COM Express Type 6 equipped with up to 45W CPUs from the Intel Core Ultra Processor family (formerly Meteor Lake H Series), specifically the 16 core, 22 thread Intel Core Ultra 9 Processor 185H.
The module also provides AAEON’s own AI Software Development Kit, which grants one-click installation of the Intel Distribution of OpenVINO Toolkit and faster NPU verification, aimed at making AI model development, refinement, and deployment easier for its customers, thus shortening time to market. With respect to OS options, the COM-MTHC6 supports Windows 11 and Linux Ubuntu 24.04/Kernel 6.8.
Conforming to the PICMG COM.0 R3.1 standard, the most notable I/O additions when compared to previous AAEON COM Express modules is the presence of one eight-lane and two four-lane PEG 4.0 slots, alongside four PCIe 4.0 and an additional standard PCIe slot. These expansion options mean the module is capable of supporting up to eight PCIe devices, such as multiple high-performance GPUs, capture cards and storage modules, with the additional option of one four-lane PEG 4.0 slot being used for NVMe SSD preinstallation.
Other key interfaces include standard industrial communication headers such as an 8-bit GPIO, two UART, I2C, and SMBus. Given AAEON seem to be marketing the module for applications that require the capacity to run more intensive AI-workloads in harsh environments like factories and roadside units, this I/O is bolstered by a 9V to 16V power input range.
The COM-MTHC6 also provides four simultaneous display outputs through a variety of interfaces, including three DDI offering 4K resolution, one of which is co-layed with a VGA connector. Other display options include LVDS as a default, co-layed with eDP.
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