Panel-level packaging is gaining momentum in the semiconductor industry with regard to efficiency and scrap reduction. To support customers in its practical implementation, Asahi Kasei has combined the properties of its photosensitive polyimide (PSPI) and dry-film photoresist (DFR) in a new photosensitive film. The new material is currently undergoing customer validation.
Asahi Kasei has developed a new PSPI film based on its extensive experience in producing liquid PSPIs used for buffer coatings and passivation layers in semiconductor manufacturing, utilizing the SUNFORT-DFR for temporary lithographic structuring of circuits on substrates and wafers. The film can increase productivity in the semiconductor packaging industry because it can be easily and uniformly applied to large-format, square panel substrates using lamination processes. Furthermore, it is designed to build a higher number of insulating layers. The film is particularly suitable for redistribution layers (RDLs) in semiconductor packaging and as an insulating layer on packaging substrates.
By combining the new PSPI film with the SUNFORT TA series (which enables the formation of 1.0 μm wide conductor tracks), both fine conductor patterns and insulating layers can be produced through film lamination. Asahi Kasei is also developing solutions that combine the PSPI film with the SUNFORT CX series, enabling the production of high-aspect-ratio copper pillars, as required for three-dimensional semiconductor packaging. Nobuko Uetake, Senior Executive Officer at Asahi Kasei and responsible for the Electronic Materials business unit, explained: “With the increasing capabilities of AI semiconductors, the field of advanced packaging requires process technologies that cover larger areas and offer higher precision. With our new PSPI film product, we aim to contribute to increasing the yield and productivity of our customers while supporting further development in the field of advanced packaging.”
Asahi Kasei has positioned its Electronic Materials business unit as a key growth driver within its current mid-term management plan, “Trailblaze Together.” Materials such as PSPI and SUNFORT DFR are already finding applications in advanced packaging. With the increasing demands of AI data centers, the company is experiencing growing demand for advanced materials for semiconductor manufacturing. As we transition from wafer-level to panel-level packaging and increase three-dimensionality, conductor patterns are becoming ever finer. Simultaneously, the number of layers is increasing, further raising the performance requirements for the materials used.
