OMRON, will participate in SEMICON Taiwan 2026, to be held from September 2 to 4, 2026, at the Taipei Nangang Exhibition Center, TaiNEX 1 and 2. At booth Q5842 on the first floor of TaiNEX 2, OMRON will showcase inspection automation solutions for semiconductor and electronic component manufacturing. As AI, high-performance computing (HPC), and advanced packaging technologies advance rapidly, quality assurance in semiconductor production is shifting beyond defect detection toward identifying root causes and using inspection data to improve manufacturing processes.
Centered on quality visualization and data utilization, OMRON will present 3D X-ray inspection, Digital Twin technology, and automation control solutions for semiconductor manufacturing, covering applications from R&D and prototype evaluation through mass production.
Exhibition Concept: Enhancing AI Manufacturing Through Quality Visualization
3D CT visualizes internal structures and quantifies quality conditions.
Inspection data is transformed into Quality Data to support continuous process improvement from R&D through mass production.
Exhibition Overview
| Event | SEMICON Taiwan 2026 |
|---|---|
| Dates | Wednesday, September 2 to Friday, September 4, 2026 |
| Venue | Taipei Nangang Exhibition Center, TaiNEX 1 and 2 |
| OMRON Booth | TaiNEX 2 / 1F / Q5842 |
| Exhibition Focus | Inspection automation solutions for semiconductor and electronic component manufacturing |
Key Highlights
CT-Based 3D X-ray Automated Inspection Solution for Advanced Packaging
Designed to meet the inspection requirements of advanced packaging, including TGVs, microbumps, voids, and chiplets, the solution combines automated X-ray inspection (AXI) with CT-based 3D X-ray technology. It supports detailed analysis during R&D and consistent pass/fail decisions in mass production. By visualizing internal structures and enabling quantitative inspection and early identification of quality risks, the solution supports continuous process improvement.
Digital Twin × Quality Data Applications
Through its collaboration with NVIDIA Omniverse, OMRON is developing Digital Twins that leverage Quality Data. By incorporating 3D visualization generated through visual and X-ray inspections, the system can accurately reproduce substrate warpage and bonding conditions. Simulating quality conditions and applying AI also enable a new approach to quality management that directly connects inspection results with process improvement.
Material Handling, Visual Inspection, and IAB Control Technologies
OMRON will demonstrate wafer-handling technologies, component products, and related solutions, together with safety and sensor technologies developed specifically for semiconductor manufacturing at the OMRON Semiconductor Development Center.
Technical Presentations During the Event
Keynote Presentation: Strategic Materials Conference
Date: Thursday, September 3
Location: TaiNEX Hall 2 (Taipei Nangang Exhibition Center, Hall 2)
Topic: Automated Inspection Technology for Advanced Packaging Incorporating TGVs: A New Method for Achieving Consistent Pass/Fail Results from Development Through Mass Production
On-Site Seminar: TechXPOT
Time: Thursday, September 3, 13:20–13:40
Location: TaiNEX Hall 2, Booth Q6252
Topic: View It to Understand It, Quantify It to Improve It: The New Role of In-Line 3D CT X-ray Inspection in Semiconductor Back-End Processes
