IndieSemiC, an Ahmedabad-based fabless chip design company, and Kaynes Semicon Private Limited signed a Memorandum of Understanding (MoU) for a strategic Outsourced Semiconductor Assembly and Test (OSAT) collaboration, marking a significant step in strengthening India’s semiconductor packaging and manufacturing ecosystem.
The MoU establishes a framework for the qualification, assembly, and testing of QFN, BGA, and other mutually agreed semiconductor packages, in support of IndieSemiC’s growing portfolio of ultra-low-power, compact SiP modules and discrete semiconductor devices. Beyond assembly and testing, the collaboration also provides a structured framework for Design for Manufacturability (DfM), customized SiP and package co-development, and New Package Introduction (NPI) as IndieSemiC’s product portfolio continues to expand.
The MoU was signed on stage by Nikul Shah, Founder & CEO, IndieSemiC, and Jinal Shah, CMO, IndieSemiC, alongside Raghu Panicker, CEO, Kaynes Semicon.
The partnership brings together IndieSemiC’s chip design capabilities with Kaynes Semicon’s OSAT infrastructure, creating a pathway for qualification, assembly, testing, and package co-development to be executed within a single, integrated framework. This will support IndieSemiC’s focus on ultra-low-power compact SiP modules and discrete semiconductor devices, while laying the groundwork for future package expansion and NPI opportunities as the company’s product roadmap grows.
Commenting on the collaboration, Nikul Shah, Founder & CEO, IndieSemiC, said, “This partnership with Kaynes Semicon reflects where India’s semiconductor industry needs to go next: from isolated pockets of capability to a genuinely integrated value chain, where design and backend manufacturing move in lockstep. As package complexity grows and product cycles compress, the industry can’t afford design and packaging to operate in silos. Frameworks like this one, spanning qualification, DFM and NPI, are what allow India to compete on scale and speed, not just on capability. We see this as a template for how domestic design and OSAT partners should be working together going forward.”
Raghu Panicker, Chief Executive Officer, Kaynes Semicon Pvt. Ltd., said, “Our collaboration with IndieSemiC brings together their innovation in ultra-low-power SiP modules and semiconductor devices with Kaynes Semicon’s advanced OSAT capabilities. Through package qualification, DFM, customized package development and NPI support, we aim to accelerate the journey from design to scalable manufacturing. This partnership reflects our commitment to enabling innovative semiconductor companies and strengthening India’s domestic semiconductor ecosystem.”
The collaboration underscores the growing momentum toward closer integration between semiconductor design and backend manufacturing within India, as domestic companies increasingly look to build
end-to-end capability across the value chain from chip design through to package qualification and scalable production.
