Asahi Kasei receives 2024 TSMC Excellent Performance Award

In recognition of its Pimel photosensitive dielectric for advanced semiconductor packaging

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Asahi Kasei received a 2024 TSMC Excellent Performance Award for its Pimel photosensitive Polyimide material, in  recognition of its “Excellent Technology Collaboration and Production Support in  Advanced Packaging” at the 2024 Supply Chain Management Forum held by Taiwan Semiconductor Manufacturing Co., Ltd. on December 2, 2024. 

TSMC presents the Excellent Performance Award to suppliers that have made remarkable  contributions to its technology leadership and manufacturing with advanced semiconductor processes  over the past year. At the award ceremony, TSMC Chairman & CEO Dr. C.C. Wei thanked suppliers  for delivering timely and high-quality professional services to drive continuous improvement of the  supply chain and related industries. 

Pimel has been used for worldwide semiconductor applications such as buffer coatings, passivation  layers for bumping, and dielectric layers for re-distribution bumping. As semiconductor technology  continues to advance, the demand for materials like Pimel has grown, with these applications  becoming increasingly vital in supporting the evolution of more complex and compact semiconductor  devices. 

Nobuko Uetake, Lead Executive Officer of Asahi Kasei and Senior General Manager of its Digital  Solutions Administration, commented, “It is a great honor for Asahi Kasei to receive this award. Pimel photosensitive dielectric is a mainstay of our Digital Solutions, which is one of Asahi Kasei’s “10 Growth  Gears” (GG10) businesses to drive our next phase of growth. We are proud to be able to develop  Pimel products that meet customer requirements by leveraging our technological capability and  quality assurance system built up over many years. With a new plant for Pimel scheduled to start  operation this fiscal year, we look forward to providing swift and reliable supply of products that support advanced semiconductor manufacturing processes.”