SAN FRANCISCO – Under the theme, “The 75th anniversary of the Transistor and the Next Transformative Devices to Address Global Challenges,” the 68th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.
The 2022 IEDM is being planned as an in-person conference December 3-7, 2022 at the Hilton San Francisco Union Square hotel, with on-demand access to recorded presentations after the event for those unable to travel due to COVID-19 restrictions.
The paper submission deadline is Friday, July 14, 2022. Authors are asked to submit four-page camera-ready papers. Accepted papers will be published as-is in the proceedings. A few late-news papers also will be accepted, covering only the most recent and noteworthy developments. The late-news submission deadline is August 22, 2022.
The IEEE IEDM is the premier forum for technological breakthroughs in semiconductor and related device technology, manufacturing, design, physics and modeling. Each year, the world’s leading technologists gather to participate in a technical program of more than 220 presentations, panels, focus sessions, tutorials, Short Courses, supplier exhibits, IEEE/EDS award presentations and other events highlighting the industry’s best work.
IEDM 2022 encourages submissions in all areas, with special emphasis on:
- Neuromorphic / in-memory computing / AI
- 2.5/3D integration
- Quantum computing devices
- Devices for RF, 5G/6G, THz and mm-wave
- Technologies for advanced memory and logic nodes
- Power distribution network
- Non-charge-based materials, devices and systems
- Advanced power devices, modules and systems
- Sensors, MEMS and bioelectronics
- Devices/circuits/system interaction
- Package-device level interactions
- Electron device simulation and modeling
- Reliability of systems and electronic devices
- Robustness/security of electronic circuits and systems
- Optoelectronics, displays and imaging systems
The IEDM 2022 technical subcommittees are as follows:
- Advanced Logic Technology (ALT)
- Emerging Device and Compute Technology (EDT)
- Memory Technology (MT)
- Microwave, Millimeter Wave and Analog Technology (MAT)
- Modeling and Simulation (MS)
- Optoelectronics, Displays and Imaging Systems (ODI)
- Power Devices and Systems (PDS)
- Reliability of Systems and Devices (RSD)
- Sensors, MEMS and Bioelectronics (SMB)
