NXP Semiconductors announced JCOP Pay operating on JCOP 5 EMV, designed to deliver a high degree of customer customisation of payment cards, while simultaneously enhancing their security. With the most recently obtained EMVCo certification, JCOP Pay operating on JCOP 5 EMV enables customers to achieve a long lifetime for card issuance.
Inventory management represents a challenge for payment card manufacturers, as they need to be able to adapt to constantly changing consumer needs in a highly competitive industry. JCOP Pay operating on JCOP 5 EMV features flexible and secure reconfiguration up to the point of card issuance to the end consumer, allowing changes in payment scheme applications and settings. This enables efficient inventory management for customers, as well as accommodating special multi-application requests, giving customers improved customisation options and increasing their overall flexibility.
“Customisation and adaptability are crucial for payment card issuers,” said Christian Lackner, Senior Director, Secure Payment & Identification, NXP. “The flexible and secure reconfiguration options enabled by this newest generation of JCOP Pay allow our customers to rapidly shift existing inventory towards a changing set of consumer needs, ultimately giving them the flexibility needed to succeed in a competitive industry.”
JCOP Pay comes with an off-the-shelf solution for all major payment schemes, including White Label Alliance’s WLA standard, which supports the creation of domestic payment schemes. Additionally, JCOP Pay operating on JCOP 5 EMV features secure pin-sharing capabilities, allowing consumers to use multiple payment schemes with the same card and same PIN, all without compromising security.
JCOP Pay operating on JCOP 5 EMV is EMVCo ICCN certified until 2030, with backwards compatibility to the well-established JCOP Pay operating on JCOP 4 EMV. It supports elliptic curve cryptography (ECC) cryptographic algorithms for next-generation EMV applications.
In addition, JCOP Pay is optimized for conventional wire bond and inductive coupling, easing antenna tuning and enabling higher yield at card manufacturing over tolerances.
