Are you ready to dive into the next big leap in semiconductor packaging? Panel-Level Packaging (PLP) is set to revolutionize the industry with its game-changing cost-effectiveness and superior performance, making it a must-watch trend. Here’s why PLP is capturing the industry’s attention and why our report on this exciting development is a must-have:
Why Panel-Level Packaging is a Game Changer:
- Cost Efficiency and Scale: PLP is transforming semiconductor packaging by shifting to large-panel configurations. This shift not only enhances economies of scale but also boosts manufacturing efficiency. With SEMI Standard 3D20 standardizing panel sizes, equipment manufacturers are now investing heavily in tools designed to support PLP, leading to cost savings and greater productivity.
- Cutting-Edge Materials: Glass substrates are making waves in the semiconductor world. Renowned for their exceptional electrical properties and suitability for high-frequency applications, glass is becoming a preferred choice. Companies with extensive experience in glass wafer and panel production are set to lead this trend, positioning themselves at the forefront of the industry.
- Driving Technological Advancements: The demand for smaller, faster, and more capable electronic devices is skyrocketing. Technological advancements in 5G, IoT, virtual and augmented reality, and autonomous driving are pushing the limits of semiconductor technology. Our report delves into how manufacturers are rising to the challenge, developing solutions to meet these new demands.
- Enhanced Thermal Control: As integration and miniaturization continue to advance, managing thermal resistance is becoming increasingly critical. Our report explores how new panel-level packing techniques are addressing these challenges, ensuring effective heat transfer and enhanced performance
The global panel level packaging market size is estimated to reach USD 11.13 billion by 2033, up from USD 0.43 billion in 2023, at a compound annual growth rate (CAGR) of 38.60% from 2024 to 2033.
Demand for Miniaturization
The demand for miniaturization in the electronics industry is projected to support the growth of the market during the forecast period. For most of the technological advancements, miniaturization has been extremely important. Electronic packaging is one of the many procedures related to semiconductor devices and circuit technology, which acts as the foundation for highly effective, compact electronic systems.
Larger batteries can be included into devices without increasing their total size due to the miniaturization of electronic subdivisions, which makes them appealing to end users across nearly all industries.
Growth and Investments in Semiconductor Industry
The growth and investments in semiconductor industry is expected to create immense growth opportunities for the panel level packaging market in the years to come. As global demand for advanced electronic devices continues to surge, fueled by the proliferation of technologies such as 5G, artificial intelligence (AI), autonomous vehicles, and the Internet of Things (IoT), the semiconductor industry is experiencing unprecedented expansion.
In July 2024, the Semiconductor Industry Association (SIA) announced global semiconductor industry sales hit $49.1 billion during the month of May 2024, an increase of 19.3% compared to the May 2023 total of $41.2 billion and an increase of 4.1% compared to the April 2024 total of $47.2 billion.
The global semiconductor market has grown on a year-to-year basis during each month of 2024, and year-to-year sales in May increased by the largest percentage since April 2022. The Americas market experienced particularly strong growth, with a year-to-year sales increase of 43.6%.
The third phase of National Integrated Circuit Industry Investment Fund has amassed 344 billion Yuan ($47.5 billion) from the central government and various state-owned banks and enterprises including Industrial & Commercial Bank of China Ltd. This surge in investment is particularly beneficial for PLP, as it aligns with the industry’s pursuit of innovative packaging solutions that can enhance device performance while reducing size and cost.
With the semiconductor industry channelling billions of dollars into new manufacturing facilities, equipment, and technology development, there is a significant opportunity for PLP to be adopted on a larger scale.
Regional Insights:
Asia Pacific is likely to grow at fastest CAGR of 40.89% during the forecast period. This is owing to the well-established infrastructure of the semiconductor fabrication as well as the presence of the advanced electronics manufacturing hubs in the economies like China, South Korea, Taiwan and Japan. Furthermore, the growing investment in the semiconductor production is also expected to contribute to the growth of the market in the region.
North America held considerable market share of 30.82% in 2023. This is due to the presence of leading semiconductor companies and research institutions such as Intel Corporation, Qualcomm Incorporated, NVIDIA Corporation and Texas Instruments, among others.
Also, the increasing demand for high-performance computing (HPC), driven by the rise of data centers, artificial intelligence (AI) and machine learning applications is further expected to support regional growth of the market in the years to come. Furthermore, the deployment of 5G networks across the region and rise of electric vehicles (EVs) and autonomous vehicles is also expected to support the regional growth of the market in the near future.
About The Author
Asmita Singh is a renowned author and consultant in the packaging industry, known for her deep passion for knowledge discovery and commitment to delivering actionable insights. With extensive experience in implementing advanced research methodologies, Asmita generates high-quality data and meaningful results that drive innovation and efficiency in packaging solutions. Her expertise spans the globe, offering valuable consulting services to businesses aiming to enhance their packaging strategies. Asmitas work is characterized by a dedication to excellence
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