Tag: Infineon
3D Time-Of-Flight Image Sensor – Global Market, to Exhibit Significant Opportunity...
According to TMR, the Global 3D Time-Of-Flight Image Sensor Market is accounted for $589.41 million in 2017 and is expected to reach $4,144.91 million by 2026...
Continental names Infineon Supplier of the Year
Munich, Germany – 30 July 2019 – Following the motto “Success is only possible in a team”, Continental Automotive once a year honors suppliers...
New AMR-based angle sensors from Infineon: best-in class angle accuracy at...
Munich, Germany – 19 June 2019 – On the occasion of the Sensor+Test trade fair, Infineon Technologies AG is expanding its sensor portfolio by...
New environmental sensor technology: photoacoustic spectroscopy (PAS) miniaturizes CO2 sensor XENSIV...
Munich, Germany – 19 June 2019 – City dwellers often spend a large amount of their time at home, either at an office, at school....
World’s first monolithically integrated linear Hall sensor for ASIL D systems...
Munich, Germany – 18 June 2019 – As the first semiconductor supplier, Infineon Technologies AG will launch a seamless integrated linear hall sensor that...
Arrow Electronics, Infineon and Arkessa Work Together for IoT Devices Globally
CENTENNIAL, Colo. May 25, 2019 - Technology solutions provider Arrow Electronics has announced a global agreement with Infineon and Arkessa that will further extend...
Infineon EasyPIM IGBT7 Modules with TRENCHSTOP technology now shipping by Premier...
May 21, 2019 - Premier Farnell, is now shipping the new 1200 V TRENCHSTOP IGBT7 and emitter-controlled EC7 diode from Infineon. Packaged in the well-known...
Portfolio of Infineon now in Mass Production Extended by CoolSiC MOSFET
8 May, 2019 - The expansion includes a surface mount device (SMD) portfolio and a 650 V CoolSiC MOSFET product family, both to be...
Infineon XENSIV TLI4971: New current sensor for industrial applications
Munich, Germany – 3 May 2019 – Infineon Technologies AG will launch a new family of current sensors and is presenting its first member...
New Infineon HybridPACK power modules
Munich, Germany 2 May 2019 – In order to support the automotive industry in building up a broad and cost competitive portfolio of hybrid...
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Fortinet Expands Integration of Cloud Security Offerings with Microsoft Azure
Bangalore, India, November 11, 2019 - Fortinet today announced the expansion of the Fortinet Security Fabric’s dynamic-cloud security offerings with Microsoft Azure, providing customers with...
