- The conference schedule is extended by two days
- On-demand viewing of pre-recorded talks starts a week before
- Live-streaming events: Q&A sessions, plenary talks, panel discussion and career session
Technical highlights:
- Stacked, self-aligned NMOS-on-PMOS nanoribbons for 3D ICs, from Intel
- A single-chip Lidar system, from Samsung
- The first 300mm platform for design of qubits for quantum computing, from imec
- A high-density logic-on-logic 3D IC design, from Arm and GLOBALFOUNDRIES
- High-density embedded memory for automotive use, from STMicroelectronics
- A large-area digital microfluidics platform, from the Chinese Academy of Sciences
- Special Focus Sessions on areas of intensive research focus (Technologies for 5G and Beyond, Future Interconnects, GaN and Sic Projections From Device to System Integration , Cryogenic Electronics, Energy Harvesting/Wireless Power Transmission, DTCO of Advanced Logic and Memory )
PISCATAWAY, NJ – The 66th annual edition of the IEEE International Electron Devices Meeting (IEDM), has announced the details of its virtual schedule.
The conference will now run from Saturday through Friday, December 12-18, 2020, and will offer a mix of live-streamed events and on-demand pre-recorded presentations, with a schedule of live Q&A sessions. The expanded schedule is intended to give global attendees enough time to review the more than 220 papers in the IEDM technical program, plus the tutorials and short courses, and to participate in the live-streamed events, such as the plenary presentations, panel discussion and career session.
This year’s theme is “Innovative Devices for a Better Future,” which reflects the fact that, at a time of great global uncertainty, electronics technology is being used much more broadly than ever before to address the world’s most pressing challenges.
“This year’s format may be different, but what hasn’t changed at all is that IEDM will once again offer an outstanding technical program that showcases important breakthroughs in key semiconductor and related technologies, which are essential for the progress of modern society,” said Dina Triyoso, IEDM 2020 Publicity Chair and Technologist at TEL Technology Center, America, LLC. “I’m very proud of the fact that, despite the laboratory restrictions and all of the other challenges imposed on us by the pandemic, our community has persevered and driven the state-of-the-art of electronics technology forward yet again.”
“Although a virtual experience doesn’t give us the ability to see our colleagues in person, it does provide unique opportunities which we have tried to maximize,” said Meng-Fan (Marvin) Chang, IEDM 2020 Publicity Vice Chair, IEEE Fellow, Distinguished Professor of Electrical Engineering at National Tsing Hua University and Director of Corporate Research at TSMC. “For example, if IEDM were a physical event this year, nine technical sessions would run in parallel. An attendee likely would find it difficult to attend all talks of interest. But with recorded presentations available on-demand a week ahead of time, that roadblock is eliminated.”
The schedule for IEDM 2020 is as follows (all times are U.S. Pacific Time):
Technical Program
On-demand pre-recorded presentations will be available beginning Monday, Dec. 7. Live-streamed session summaries by the session chairs with Q&A opportunities will take place Monday-Friday, Dec. 14-18, on the dates and times given in the conference program.
Tutorial Sessions 1,2,3
On-demand pre-recorded talks will be available beginning Dec. 5, and a live session summary/Q&A event will take place Saturday, Dec. 12 from 8-8:45 a.m. The tutorials are:
- Quantum Computing Technologies, Dr. Maud Vinet, CEA Leti
- Advanced Packaging Technologies for Heterogeneous Integration, Dr. Ravi Mahajan & Dr. Sairam Agraharam, Intel
- Memory-Centric Computing Systems, Prof. Onur Mutlu, ETH Zurich
Tutorial Sessions 4,5,6
On-demand pre-recorded talks will be available beginning Dec. 5, and a live session summary/Q&A event will place Saturday, Dec. 12 from 8:45-9:30 a.m. The tutorials are:
- Imaging Devices and Systems for Future Society, Dr. Yusuke Oike, Sony Semiconductor Solutions
- Innovative Technology Elements to Enable CMOS Scaling in 3nm and Beyond – Device Architectures, Parasitics and Materials, Dr. Myung-Hee Na, imec
- STT and SOT MRAM Technologies and Their Applications from IoT to AI Systems, Prof. Tetsuo Endoh, Tohoku Univ.
Short Courses
Innovative Trends in Device Technology to Enable the Next Computing Revolution, organized by Anne Vandooren, imec. This course will cover a range of relevant topics, including next generation nanosheet transistor; packaging technologies for 3D integration; RF front-end modules; power delivery/regulation; and monolithic and chiplet integration.
- On-demand pre-recorded presentations will be available beginning Dec. 6
- A live summary/Q&A session will take place Sunday, Dec. 13 from 8-9:30 a.m.
Memory-Bound Computing, organized by Ian Young, Intel. The topics to be discussed include the role of persistent memory for high-performance computing; HBM DRAM and beyond; memory for secure computing; PUFs for hardware security; alternate SRAM technologies; analog memory needs for AI; and one-shot learning with memory-augmented neural networks.
- On-demand pre-recorded presentations will be available beginning Dec. 6
- A live summary/Q&A session will take place Sunday, Dec. 13 from 9:30-11 a.m.
Plenary Presentations
Each will be live-streamed, and they are 45-minute talks followed by a 15-minute Q&A:
- Monday, Dec. 14, 8-9 a.m.: Sri Samavedam, Senior VP CMOS Technologies, imec – Future Logic Scaling: Atomic Channels to Deconstructed Chips
- Tuesday, Dec. 15, 8-9 a.m.: Naga Chandrasekaran, Senior VP of Process R&D and Operations, Micron Technology – Memory Technology: Innovations Needed for Continued Technology Scaling and Enabling Advanced Computing Systems
- Wednesday, Dec. 16, 8-9 a.m.: Sungwoo Hwang, President, Samsung Advanced Institute of Technology – Symbiosis of Semiconductors, AI and Quantum Computing
Panel Session
Thursday, Dec. 17, 7:30-9 a.m.: IEDM 2020 has partnered with the journals Nature and Nature Electronics to offer a unique live-streamed panel discussion. It will be moderated by Ed Gerstner, Director of Journal Policy & Strategy for Springer Nature:
- What Can Electronics Do to Solve the Grand Societal Challenges Going Forward? Following a year of global upheaval and acute challenges, this panel discussion will reflect on the place of electronics and the semiconductor industry in the future world. It will bring together experts from across science, technology, media and policy to discuss future directions of microelectronics, and will explore the role future technologies can play in addressing grand societal challenges and in creating a more sustainable, equitable future. It will also consider challenges in attracting the best students and the evolution of electronics education to suit future needs.
Career Session
Friday, Dec. 18, 8-9 a.m.: IEDM 2020 will have a career-focused session featuring industry and scientific leaders talking about their personal experiences in the context of career growth. It will be live-streamed and will feature:
- Prof. Tsu-Jae King Liu, IEEE Fellow, Professor & Dean at University of California-Berkeley and member of the Board of Directors of Intel Corp.
- Dr. Heike Riel, IBM Fellow, Head of Science & Technology and Lead of IBM Research Quantum Europe.
For more information, please visit at: ieee-iedm.org
