Asahi Kasei Adds SUNFORT Slitting Facility

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Asahi Kasei, a diversified global company, constructed a new  slitting facility for SUNFORT dry film photoresist (DFR) at its manufacturing site in  Tainan, Taiwan, on July 3. Commercial operations are scheduled to commence this month. 

Asahi Kasei has been slitting SUNFORT DFR at its Tainan site since 1997. In recent years, demand  for advanced semiconductor packaging has grown significantly, driven by AI and the resulting increase  in data processing requirements. Accordingly, DFR used in semiconductor packaging must also meet  increasingly stringent standards for both quality and supply reliability. In this context, Taiwan is a  strategically important location with a strong concentration of semiconductor packaging-related  companies, making it essential to have a supply system capable of supplying products rapidly and  reliably in close proximity to customers. 

Slitting is the process by which master rolls of film are cut into narrower widths in accordance with  individual customer requirements. It is a critical process that directly impacts both product quality and  supply reliability. 

To respond to growing market demand for DFR, Asahi Kasei’s new slitting facility is equipped with  state-of-the-art machines and some of the most rigorous cleanroom standards for improved  productivity and dependable supply. The facility represents an investment of approximately ¥2 billion  (approximately $12 million or €11 million) and will expand capacity by 40% with the potential to double  current output. 

SUNFORT DFR delivers ultra-high resolution with conventional stepper exposure systems and laser  direct imaging (LDI) systems, which transfer circuit patterns onto substrates for packaging. This  approach improves performance and precision in semiconductor manufacturing back-end processes.  

Asahi Kasei’s investment in SUNFORT DFR aligns with the company’s positioning of its Electronics  Business as a strategic growth driver. In May 2025, Asahi Kasei also launched SUNFORT TA, its  newest DFR series tailored for advanced semiconductor packaging used in AI servers. 

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