ASRock Releases iEP-6010E Series IoT Controller

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ASRock Industrial announce the release of iEP-6010E Series Industrial IoT Controller powered by NVIDIA Jetson Orin NX/ Jetson Orin Nano system-on-module (SOM) with up to 100 SPARSE (50 DENSE) INT8 TOPS, providing higher edge computing power for AI applications. The compact iEP-6010E Series feature high performance and energy-efficient inferencing, flexible I/Os and rugged design for harsh environments, supporting 12V to 36V wide range DC power input and wide operating temperature from -25°C to 60°C. The iEP-6010E Series is perfect for real-time AI video processing at the edge, optical inspection, autonomous operation, traffic management, public safety, and many other embedded AI applications.

Revolutionizing AI Computing with Jetson Orin NX/Nano SOM in a Compact Package

The iEP-6010E Series support different configurations, including iEP-6010E based on NVIDIA Jetson Orin NX SOM with 16GB 128-bit LPDDR5 memory, iEP-6011E based on NVIDIA Jetson Orin NX SOM with 8GB 128-bit LPDDR5 memory, iEP-6012E based on NVIDIA Jetson Orin Nano SOM with 8GB 128-bit LPDDR5 memory, and iEP-6013E based on NVIDIA Jetson Orin Nano SOM with 4GB 64-bit LPDDR5 memory. The NVIDIA Jetson Orin NX 16GB SOM boosts up to 100 SPARSE (50 DENSE) INT8 TOPS

and almost 5X performance compared to the previous NVIDIA Jetson Xavier NX SOM. The ranged selections come in compact packages of 55 x 170 x 134mm for Basic SKU and 68 x 170 x 134mm (W x H x D) for PoE/5G SKU. With Jetson Orin NX or Orin Nano SOM, the iEP-6010E Series enhance AI processing power of embedded and edge computing devices that demand increased performance but are constrained by size, weight, and power budgets.

iEP-6010E Series Offer Flexible I/Os for Edge AI Applications

The iEP-6010E Series help Edge AI video solution implementation with rich I/Os flexibility. The Series feature two USB 3.2 Gen 2×1 (one with locking feature), two USB 2.0, and two Gigabit LAN in Basic SKU, or PoE SKU with up to two IEEE 802.3AF PoE for camera deployment with power supply and video transmission. There are one HDMI 2.0 for Orin NX SOM and HDMI 1.4 for Orin Nano SOM, one RS-232, one RS-232/422/485 serial ports as well as proprietary IOs- one DB15 connector featuring proprietary design by DIO, incorporating signals for Power/GND and Remote Power Button/Reset. The other DB15 connector is also proprietary including I2C, SPI, CANBUS interface and Power/GND pins, designed for embedded applications. Moreover, the Series’ storage support includes one M.2 Key M (2280) for PCIe Gen 4×4 on iEP-6010E/iEP-6011E and Gen 3×4 on iEP-6012E/iEP-6013E for NVMe SSD storage, with one available Micro SD card slot.

Advanced RF Capabilities and Rugged Design

The iEP-6010E Series support diverse expansions to assist in wireless communications and advanced-level RF connectivity, these include one M.2 Key B socket (3042/3052) for optional 5G modules or 4G LTE module on 5G SKU. There is also one M.2 Key E socket (2230) for optional Wi-Fi modules for all of the SKUs. RF capabilities are through up to four 5G/4G LTE antennae and two Wi-Fi antennae for 5G SKU set up for excellent communications. With a rugged design, the iEP-6010E Series withstand wide operating temperature from up to -25°C to 60°C and support 12V to 36V wide range DC input, with 80V Surge Protection, OVP, UVP, OCP, Reverse Protection. It also features the Phoenix type connector, or PD3.0 20V USB Type-C power adaptor interface with locking mechanism for users to leverage the battery bank for mobility device use cases. In addition, it can serve as backup DC input when the Phoenix type DC IN falls within the range of 21V~36V. The carrier board inside the chassis reserved two dual-lane MIPI-CSI2 interfaces for image capturing as well.

“With the increasing variety and inspirations in Edge AI applications, it is exciting for ASRock Industrial to extend our new product lineup, powered by NVIDIA Jetson platform, by introducing the iEP-6010E Series. This release demonstrates our commitment to meeting the expanding breadth and depth for AI application requirements worldwide.” said James Lee, President of ASRock Industrial. The Series offer enhanced speed and energy efficiency, versatile I/O options, and advanced RF capabilities that will stimulate the development of new applications in Edge AI.