The IC Ecosystem Show (ICES 2026), one of the flagship theme shows of the 26th China International Industry Fair (CIIF 2026), is officially scheduled to take place from October 12 to 16, 2026, in Hall 5.2 at the National Exhibition and Convention Center (Shanghai), China. Serving as a premier semiconductor exhibition in the Asia-Pacific region, ICES 2026 will gather top semiconductor companies, technology innovators, equipment suppliers, and industrial end-users to drive cross-border collaboration and accelerate chip-intelligence convergence.
Mapping an End-to-End Industry Value Chain Driven by Applications
Rather than presenting products by category alone, ICES 2026 is organized around real-world industrial applications. The exhibition showcases technologies selected specifically for industrial-grade reliability, automotive-grade compliance, and AI applications and embodied intelligence, closing the loop from core chips to industrial scenarios. Acting as a national strategic platform and global semiconductor hub, ICES connects the complete value chain—from design and wafer fabrication to advanced packaging, equipment, and downstream system integration.
Five Dedicated Exhibition Zones for Ecosystem Synergy
ICES 2026 features five specialized exhibition zones designed to foster ecosystem-wide synergy and commercialization. The journey begins in the Integrated Circuit Design Zone, showcasing EDA tools and platforms, IP cores, IC design services, and core chip solutions, including HPC processors, memory chips, power management ICs (PMICs), and power semiconductors. Moving along the manufacturing ecosystem, the Wafer Fabrication Zone highlights logic and specialty process platforms, IDM and memory manufacturing, compound semiconductor manufacturing, and smart fab facilities. To complement this, the Packaging & Testing Zone presents advanced packaging technologies such as Wafer-Level Packaging (WLP) and System-in-Package (SiP), alongside specialized packaging for automotive electronics and MEMS, high-performance inspection and analysis, and next-generation processes like glass substrates.
Furthermore, trade visitors exploring the Semiconductor Equipment & Materials Zone will discover core wafer fab equipment—including lithography, etching, thin-film deposition, cleaning, and CMP—as well as metrology and inspection systems, compound-semiconductor tools, silicon wafers, photoresists, electronic specialty gases, and key subsystems. Finally, the Application & System Integration Zone brings together leading end-user enterprises to showcase “Chip + Embedded Solutions” across AI infrastructure, Embodied AI, intelligent vehicles, smart home appliances, and wearable electronics.
High-Level Summit & Specialized Technical Forums
Alongside the static exhibition, ICES 2026 will host a comprehensive three-tier conference program, including a flagship industry summit, over 10 specialized technical forums, and exclusive executive networking events. Bringing together government officials, global industry executives, technology experts, and investors, the program will deeply explore policy developments, technology trends, and market dynamics. Attendees will have the opportunity to engage in critical tracks focusing on the latest breakthroughs in automotive semiconductors, advanced memory technologies, the rapid evolution of embodied AI and industrial robotics, and the future of next-generation IC packaging and ecosystem integration.
Join the Global Semiconductor Ecosystem in Shanghai
As a vital part of CIIF 2026 — a 300,000-square-meter mega-event showcasing the complete smart and sustainable manufacturing supply chain including foundational materials, key components, cutting-edge manufacturing equipment and solutions — ICES 2026 serves as an essential platform for technical exchange, product debuts, and precision business matchmaking.
Visitor pre-registration for CIIF 2026 and the IC Ecosystem Show (ICES) is now officially live. Industrial professionals, trade buyers, and global technology providers are cordially invited to gather in Shanghai this October to unlock new market opportunities and shape the future of smart manufacturing.
