IEEE International Electron Devices Meeting Announced 2020

Call for Papers


Special focus sessions will be held on the following topics:

  • Technologies Enabling 5G and Beyond
  • Future Interconnect Technology
  • Advanced IC Design and Integration in Wide-Bandgap Technologies
  • Device Technologies for Cryogenic Electronics
  • Energy Harvesting and Wireless Power Transmission
  • Next Generation Design-Technology Co-Optimization (DTCO)

SAN FRANCISCO, CA (May 28, 2020) – Under the theme “Innovative Devices for a Better Future,” the 66th annual IEEE International Electron Devices Meeting (IEDM), to be held December 12–16, 2020 at the Hilton San Francisco Union Square hotel, has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.

The paper submission deadline is Friday, July 24, 2020. Authors are asked to submit four-page camera-ready papers. Accepted papers will be published as-is in the proceedings. A few late-news papers also will be accepted, covering only the most recent and noteworthy developments.  The late-news submission deadline is August 31, 2020.

The IEDM is the premier forum for technological breakthroughs in semiconductor and electron device technology, manufacturing, design, physics and modeling. Each year, the world’s leading technologists gather to participate in a technical program of more than 220 presentations, plus panels, focus sessions, tutorials, Short Courses, supplier exhibits, IEEE/EDS award presentations and other events highlighting the industry’s best work.

“Last year’s IEDM conference was a great success, with about 1,900 attendees, the most in more than a decade, and the highest participation ever in our tutorials and short courses. No matter where you turned something exciting was happening, whether it was a greatly anticipated late-news paper on 5nm technology; thought-provoking plenary talks; the popular quantum computing infrastructure focus session and Saturday tutorials; or the many papers on novel 3D and memory technologies, just to name a few,” said Dina Triyoso, IEDM 2020 Publicity Chair and Technologist at TEL Technology Center, America, LLC. “This year we have chosen the theme ‘Innovative Devices for a Better Future’ to emphasize how the people who attend IEDM, and the industry as a whole, can help to solve some of the greatest challenges the world faces in these uncertain times.”

“Transistors and other electron devices are the building blocks of electronic systems which are used in a greater number of applications, to solve a wider variety of problems, than ever before,” said Meng-Fan (Marvin) Chang, IEEE Fellow and Distinguished Professor of Electrical Engineering at National Tsing Hua University. “Helping to make this possible are the state-of-the-art results that will be presented at IEDM, and the opportunity to interact with colleagues from academia and industry around the world.”

IEDM 2020 encourages submissions in all areas, with special emphasis on:

  • Neuromorphic computing/AI
  • Quantum computing devices
  • Devices for RF, 5G, THz and mmWave
  • Advanced memory technologies
  • Technologies for advanced logic nodes
  • Non-charge-based devices and systems
  • Advanced power devices, modules and systems
  • Sensors, MEMS and bioelectronics
  • Package-device level interactions
  • Electron device simulation and modeling
  • Robustness/security of electronic circuits and systems
  • Optoelectronics, displays and imaging systems

The IEDM technical subcommittees are as follows:

  • Advanced Logic Technology (ALT)
  • Emerging Device and Compute Technology (EDT)
  • Memory Technology (MT)
  • Microwave, Millimeter Wave and Analog Technology (MAT)
  • Modeling and Simulation (MS)
  • Optoelectronics, Displays and Imaging Systems (ODI)
  • Power Devices and Systems (PDS)
  • Reliability of Systems and Devices (RSD)
  • Sensors, MEMS and Bioelectronics (SMB)

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