The India Electronics and Semiconductor Association (IESA) welcomes the inauguration of 3DGS Semicon’s advanced packaging facility in Odisha by Hon’ble Union Minister Shri Ashwini Vaishnaw and Hon’ble Chief Minister Shri Mohan Charan Majhi, calling it a strong demonstration of India’s shift from intent to execution in semiconductors.
The Heterogeneous Integration Packaging Solutions unit of 3D Glass Solutions marks a significant capability leap in advanced packaging—an area increasingly seen globally as critical as advanced process nodes. It can help India move from semiconductor participation to semiconductor value capture by strengthening the semiconductor value chain, enhancing supply chain resilience, supporting chiplet and advanced packaging innovation, and advancing India’s journey toward next-generation semiconductor system integration, said Ashok Chandak, President, IESA and SEMI India.
As a valued Industry player, 3DGS Semicon’s achievement reflects the increasing depth and maturity of India’s semiconductor ecosystem—from design and engineering to packaging and product commercialization. It signals that India is progressing beyond design leadership toward manufacturing sophisticated semiconductor products within the value chain.
Following recent semiconductor project inaugurations and with additional projects expected this year, this milestone underscores the strong policy alignment and execution momentum driven by MeitY, ISM, and proactive state governments. It sends a clear signal to global investors that India is accelerating toward sustained, large-scale semiconductor execution, commented ,Mr. Chandak.
As India advances toward a $400 billion electronics market and a $103 billion semiconductor market by 2030, developments such as 3DGS demonstrate that the country is building critical capabilities across the value chain. Odisha’s emergence as a semiconductor hub further strengthens the Make in India vision and positions India as a credible and competitive player in the global semiconductor landscape.
