Las Vegas, Nevada– MediaTek will demonstrate production-ready products featuring Wi-Fi 7 connectivity at CES 2023. These products are the culmination of MediaTek’s investment in Wi-Fi 7 technology. It focuses on reliable and always-on connected experiences on a wide variety of devices in several product categories.
As the most current and powerful Wi-Fi standard, Wi-Fi 7 utilizes record-breaking 320MHz channel bandwidth and 4096-QAM modulation. Multi-Link Operation (MLO) also enables the Wi-Fi connection to aggregate channel speeds and alleviate link interruption in congested environments.
“Last year, we gave the world’s first Wi-Fi 7 technology demonstration, and we are honored to now show the significant progress we have made in building a more complete ecosystem of products,” said Alan Hsu, corporate vice president and general manager of the Intelligent Connectivity Business unit at MediaTek. “This lineup of devices illustrates our commitment to providing the best wireless connectivity.”
Using a 6nm process, MediaTek’s Wi-Fi 7 solution offers a reduction in main power consumption by 50%, a 25x reduction in CPU utilization. It also has 100x lower MLO switch latency when compared to competing options. It includes 4T5R and penta-band mesh to address a larger area of coverage and higher number of linked devices.
The devices on demonstration this week utilize MediaTek’s latest Filogic chips. It combines a Wi-Fi 7 access point technology to broadband operators, retail router channels and enterprise markets.
“We are excited to collaborate with MediaTek on the latest Wi-Fi 7 technology. Fast and reliable wireless connectivity is crucial for consumers. We believe that combining powerful AMD Ryzen processors with MediaTek’s advanced connectivity technologies will deliver an excellent user experience,” said Jason Banta, corporate vice president and general manager, client OEM at AMD.
To learn more about MediaTek’s Filogic portfolio, please visit: https://www.mediatek.com/products/networking-and-connectivity/
