Mouser Electronics New Product Insider: August 2019

Global Distributor Leads in Introduction of Leading Technologies

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August 29, 2019 – Mouser Electronics, Inc. specializes in the rapid introduction of new products and technologies. As the industry leader in New Product Introductions (NPIs), Mouser makes it a priority to stock the newest products and technologies from its nearly 800 manufacturer partners, giving customers an edge and helping speed time to market.

Last month, Mouser launched more than 619 new products and technologies ready for same-day shipment.

Some of the products introduced by Mouser last month include:

  • Xilinx Zynq-7000 SoCs

Xilinx Zynq-7000 system-on-chips (SoCs) are available with one or two Arm Cortex-A9 cores integrated with 7 series 28nm programmable logic.

  • Superior Sensor Technology HV120 Differential Low Pressure Sensors

The Superior Sensor Technology HV120 sensors offer four full scale pressure ranges and feature piezoresistive MEMS technology that enables higher performance for applications that require zero stability and/or low-drift performance.

  • TE Connectivity’s Buchanan Wiremate ITB Releasable Poke-in Connectors

TE Connectivity’s Buchanan Wiremate inverted thru-board (ITB) releasable poke-in connectors facilitate fast and easy termination with no wire crimping required for linear and circular LED modules.

  • EPCOS / TDK Mini Lateral PowerHap Piezo Actuators

TDK Mini Lateral PowerHap devices are small, rectangular piezo actuators with high acceleration and short response time for haptic feedback.

To see more of the New Product Insider highlights, go to www.mouser.com/newproductinsider.