Silicon Integration Initiative CMC Reveals 2026 Compact Modeling Meet

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The Si2 Compact Model Coalition, IEEE, and IEEE EDS are sponsoring the second edition of the International Compact Modeling Conference (ICMC), a two-day in-person event bringing together global experts in design, process technology, and model development to discuss advancements in semiconductor device modeling.

The conference will be held from July 30-31, 2026 at the Queen Mary in Long Beach, California.

Corporate Sponsors: Cadence | Keysight | Micron | Qualcomm | Sandia National Laboratories | Siemens |Synopsys |TSMC

Media Sponsors: SemiWilki | Semiconductor Digest

Researchers and practitioners are invited to contribute to the evolution of device models through oral and poster presentations in the following highlighted themes:

  • Electrostatic Discharge (ESD) modeling for protection design
  • Reliability and aging-aware compact models and simulation techniques
  • AI or Machine Learning for model development, parameter extraction, circuit simulation efficiency, etc.

Submissions are also accepted in the following areas:

  • Application of Device Models
  • Device Model Development
  • Model Enhancements and Implementations
  • Emerging Devices