Abstract: The ability to dissipate heat is one of the most important features of modern electronic devices and is usually a limiting factor in the miniaturization of these devices.

Designing power electronics and electronic consumer devices involves having to balance strict space and temperature design constraints with the need to implement several heat sources, such as microchips and battery packs. Simulation can be used to address the engineering challenge of fitting the different electronic components in ever-smaller form factors while also ensuring the system remains below critical temperatures.

In this webinar, we will discuss simulating heat transfer by conduction, convection, and radiation using the Heat Transfer Module, an add-on product to the COMSOL Multiphysics simulation software. We will also present some options for explicitly modeling heat sources, such as electrochemical and electromagnetic sources. The webinar will include a live demonstration of electrochemical heating and thermal management of a battery pack setup in the COMSOL Multiphysics software and will conclude with a Q&A session.

We will answer any questions you may have during the presentation or at the end of the Q&A session.