Turnium Rolls Out Next-Gen SD-WAN to Most OEM Partners

0
212

Turnium Technology Group (“TTGI” or “the Company”), a global innovator in SD-WAN and connectivity solutions, announced the successful deployment of its revolutionary Version 7.x RAC1 platform to 46 OEM partner environments, representing 75% of its partner ecosystem.

The new platform, code-named “Laywire”, represents nearly a decade of development and delivers breakthrough performance improvements including 10x faster throughput speeds and 40x higher management server density, compared to the previous version(s).

Key Performance Metrics:

  • 10x throughput improvement on existing hardware (achieving 3Gbps on processors that previously delivered 300Mbps)
  • 24Gbps per core throughput on Xeon Gold 6430 processors
  • 100,000 nodes supported per management server (up from 2,000)
  • 2000:1 edge-to-core node ratio, dramatically reducing infrastructure costs

“Our design philosophy focuses on making advanced use cases easily deployable while ensuring customer privacy and security,” said Josh Hicks, VP of Product and Development. “Laywire enables our partners to break through the traditional 1Gbps barrier and support ultra-high speeds ranging up to 24Gbps.”

New Business Opportunities Enabled:

  • Multi-gigabit SD-WAN for core and edge connectivity
  • Network-as-a-Service (NaaS) deployments
  • Cost-effective large-scale IoT implementations
  • Global multi-site enterprise networks
  • Hybrid-cloud architectures

The platform addresses the evolving needs of managed service providers (MSPs), telecommunications companies, and internet service providers (ISPs) seeking scalable, high-performance connectivity solutions.

“This achievement represents another defining moment for Turnium,” said Doug Childress, Global CEO. “Our R&D team has set a new industry benchmark for SD-WAN technology delivery. Their decade-long commitment to innovation positions Turnium at the forefront of next-generation networking solutions.”