congatec, a leading provider of embedded and edge computing technology boosts AI performance for medical, robotics, industrial, retail, and gaming applications, delivering up to 99 TOPS (Tera Operations per Second). This exceptional AI performance is driven by the new conga-TC750 Computer-on-Module (COM) in the COM Express Compact Type 6 form factor, which is powered by Intel Core Ultra Series 2 processors (codenamed Arrow Lake) with Lion Cove and Skymont P- and E-cores, providing up to 16 cores and 22 threads alongside an integrated GPU and NPU.
Developers already working with COM Express Compact platforms (95 mm x 95 mm), such as the conga-TC700, will benefit particularly from the quick upgrade path to unprecedented AI performance. Applications with high-performance requirements –Intel Core Ultra processors especially in graphics and AI – can take advantage of the enhanced x86 and AI capabilities offered by Intel’s new System-on-Chip (SoC) with minimal development effort and a faster time-to-market.
The SoC achieves 99 TOPS by combining the exceptional AI performance of the integrated Intel Xe-LPG+ graphics processor (iGPU) – optimized for parallel, high-throughput workloads and delivering up to 77 TOPS (compared to its predecessor Meteor Lake’s 18 TOPS) – with a highly energy-efficient NPU providing up to 13 TOPS, and a CPU contributing 9 TOPS for fast response times. The new SoC also features Intel’s latest Xe-LPG+ graphics engine. With its standardized module concept enabling simple upgrades and high scalability, the conga-TC750 is an excellent choice for high-performance IPCs and thin clients, allowing them to stay up to date with easy module replacements. Additionally, AI-supported medical imaging, test and measurement, and graphics-based applications benefit greatly from the new module’s significant performance.
“Our new conga-TC750 COM Express Compact modules with Intel Core Ultra Series 2 processors are ideal for applications that always require the latest performance and follow innovation cycles of three to five years. Intel Core Ultra processors The module concept excels in these scenarios, providing an application-ready computing core that helps developers save time and costs during design-in, scale easily, and achieve a shorter time-to-market. By replacing modules while retaining the carrier board, developers avoid the expense and effort of a full system replacement or redesign,” explains Maximilian Gerstl, Product Manager at congatec.
The feature set in detail
The new conga-TC750 COM Express Compact modules are powered by Intel Core Ultra Series 2 processors with a long-term availability of five years. This makes them ideal for high-performance applications requiring upgrades every three to five years.
Beyond their impressive 99 TOPS AI performance, the conga-TC750 modules also offer up to 128 GB DDR5 memory with speeds of up to 6400 MT/s and in-band ECC. An optional NVMe x4 SSD provides up to 1 TB of non-volatile storage. To meet future connectivity demands, the modules feature a 2.5 GbE port via the Intel i226 Ethernet controller with TSN support. They also provide comprehensive peripheral connectivity, including up to 16 PCIe Gen4/5 lanes, two USB4, four USB3.2 Gen2, and eight USB2.0 ports, as well as SATA, UART, GPIOs, SPI, LPC, and I2C. Supported operating systems include Microsoft Windows 11, Windows 10/11 IoT Enterprise, ctrlX OS, Ubuntu, Linux, and Yocto. The conga-TC750 also enables system consolidation through the integrated Hypervisor-on-Module from Real-Time Systems.
Additionally, the conga-TC750 is available as an application-ready aReady.COM module and can, for instance, be pre-configured with licensed ctrlX OS from Bosch Rexroth and Ubuntu Pro. The aReady.VT option allows developers to consolidate multiple workloads, such as real-time control, HMI, AI, and IoT gateway functions, on a single module. For IIoT connectivity, congatec offers its aReady. IOT software building blocks, which enable data exchange, maintenance/management of the module, carrier, and peripherals, as well as cloud connectivity upon request. To further simplify application development, congatec provides an extensive ecosystem that includes evaluation and production-ready carrier boards, customized cooling solutions, comprehensive documentation, design-in services, and high-speed signal integrity measurements.
The new conga-TC750 COM Express Compact modules are available in the following versions:
| Model | Base TDP [W] | Cores/ (P, E + LP-E) | Threads | Base clock / Turbo [GHz] | Execution Units |
| conga-TC750/ultra9-285H | 45 | 16 (6 + 8 + 2) | 16 | P-cores: 2.9 / 5.4E-cores: 2.7 / 4.5LP E-cores: 1.0 / 2.5 | 128 |
| conga-TC750/ultra7-255H | 28 | 16 (6 + 8 + 2) | 16 | P-cores: 2.0 / 5.1E-cores: 1.5 / 4.4LP E-cores: 0.7 / 2.5 | 128 |
| conga-TC750/ultra7-255U | 15 | 12 (2 + 8 + 2) | 14 | P-cores: 2.0 / 5.2E-cores: 1.7 / 4.2LP E-cores: 0.7 / 2.4 | 64 |
| conga-TC750/ultra5-225H | 28 | 14 (4 + 8 + 2) | 14 | P-cores: 1.7 / 4.9E-cores: 1.3 / 4.3LP E-cores: 0.7 / 2.5 | 112 |
| conga-TC750/ultra5-225U | 15 | 12 (2 + 8 + 2) | 14 | P-cores: 1.5 / 4.8E-cores: 1.3 / 3.8LP E-cores: 0.7 / 2.4 | 64 |
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