KIRKLAND, Wash.— Alliance Memory has announced that it has expanded its portfolio of CMOS DDR4 SDRAM with a new 16Gb device. It is in the 96-ball FBGA package. The company is providing customers with a higher-density option for a wide range of applications. The AS4C1G16D4-062BCN delivers improved performance over previous-generation DDR3 SDRAMs. Further, it is with lower power consumption and higher speeds and transfer rates.
To increase battery life in portable electronics, it features a low operating voltage of +1.2V (±0.06V). The AS4C1G16D4-062BCN is designed, qualified, and recommended for use in 5G designs, computing applications, surveillance systems, smart meters, human-machine interfaces (HMI), digital signal controllers, PNDs, and more. Moreover, the device is built on an 8n-prefetch architecture. Moreover, AS4C1G16D4-062BCN offers fast clock speeds up to 1600MHz and transfer rates up to 3200 MT/s.
The 1Gb x 16-bit AS4C1G16D4-062BCN supports sequential and interleave burst types with read or write burst lengths of BC4, BL8, and on the fly. An auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence. Further. easy-to-use refresh functions include auto- or self-refresh.
With minimal die shrinks, the DDR4 SDRAM provides a reliable drop-in, pin-for-pin-compatible replacement for numerous similar solutions. Further, eliminates the need for costly redesigns and part requalification. It is offered in the commercial (0°C to +95°C) temperature range. The device is ideal for the industrial, networking, telecommunications, gaming, and consumer markets.
Meanwhile, samples and production quantities of the AS4C1G16D4-062BCN are in stock and available now.
