With $26M in new funding, CubicPV announces plans to manufacture silicon wafers in the United States, filling a critical gap in the U.S. solar supply chain.
CubicPV announced plans to establish 10 GW of conventional mono wafer capacity in the United States. Driven by incentives in the Inflation Reduction Act, the wafers produced by the new facility could fill a void in the domestic supply chain as well as create 1,500 new direct jobs.
“The IRA represents a titanic shift in the global solar landscape, and the U.S. is poised to become the world’s most competitive location to manufacture solar. We’re excited to have a role in the U.S. manufacturing renaissance while accelerating our business plan and supporting the development of our next generation tandem module technology,” said Frank van Mierlo, CEO, Cubic.
CubicPV was formed last year from the merger of Hunt Perovskite Technologies and 1366 Technologies, a company that was founded in 2008 and headquartered in Bedford, Mass. 1366 Technologies was known for its direct wafer technology, which forms wafers directly, using molten silicon, instead of silicon ingots sawn into wafers. The advantage is less loss because it uses a kerfless wafer production that does not require silicon ingots to be sawn into wafers, a time-consuming process that wastes material as silicon dust. Instead, 1366’s technology forms wafers directly, using molten silicon.
