Infineon SECORA Pay Illuminates Payment Cards for Enhanced Contactless Experience

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Enabled by increasingly powerful technologies the convenience of tap and pay is being widely adopted, fueling the rise of contactless payments worldwide. In addition, contactless technologies are inspiring new and innovative form factors that support additional functions beyond payment. The SECORA Pay security solution from Infineon Technologies AG takes this development into account and supports card inlays with LEDs. The Visa- and Mastercard-certified product family now enables banks to design new and distinctive payment cards. Embedded LEDs provide visual feedback when the card is held up to the point-of-service (POS) terminal for a payment transaction.

“Digital payment users have high demands on the convenience, performance and security of products and solutions,” said Tolgahan Yildiz, Vice President Trusted Mobile Connectivity and Transactions at Infineon. “The SECORA Pay product portfolio not only meets these requirements, but also offers system-level innovations in a very easy-to-integrate and scalable form for the card ecosystem, such as plug-and-play LED inlays that illuminate the cards as visual feedback during the payment transactions. This makes card payments interactive without compromising on security and enhances both brand recognition and the user experience.”

The SECORA Pay product portfolio uses a security controller with certified software integrated into Coil-on-Module (CoM) chip modules. It features standardized inlays for easy and fast card production. The portfolio offers fast contactless transaction speeds and high performance. In addition, it now enables card manufacturers to flexibly position white LEDs in a defined area. These can be customized with different colors using printing foil further enhancing brand recognition. The LED illumination is powered by the POS terminal’s NFC field, eliminating the need for battery power. In addition, the product family can be integrated into a card manufacturers’ production process with minimal changes improving scalability. Quick and easy integration into EMVCo compliant dual interface cards is possible, including a simple and fast certification process for faster time-to-market.