In this exclusive interview with Mike Ballard, Senior District Manager for End Equipment, Microchip Technology, he states the impact on the demand for IoT, Microchip’s latest offerings and portfolio catering the IoT space. He also elaborates on IoT security and the company’s key focus into this segment. Excerpts below.
TimesTech Buzz: What do you think will be the impact on the demand for IoT as the global epidemic continues? In addition to the epidemic, what are the other important driving forces for the development of IoT?
Mike Ballard: The recent epidemic has caused a number of markets to see unprecedented growth in the past year; one of them being the Internet of Things (IoT). Factors such as the massive work from home (WFH) mandate, to the need for new medical products, to the recent labor shortage seen in the US, are all driving new market demands. Labor shortages are forcing certain businesses to look into automation to mitigate the risks associated including inconsistent output, training delays, and labor cost fluctuations. Artificial Intelligent, Machine Learning and Security/Authentication are going to play significant roles in order to meet the needs of these newly emerging markets.
TimesTech Buzz: Connectivity is a key component of IoT. Microchip has introduced many such IoT chips. In your opinion, what are the changes in the requirements and characteristics of IoT for connectivity chips? What products have Microchip launched recently to address these requirements and changes?
Mike Ballard: While connectivity is critical for every IoT application, that connection comes with risk. Whether it is transferring sensitive medical data, or authenticating a new node into an industrial application, all connectivity exposes the network to potential security breaches. Without proper security and authentication systems, companies may be unwittingly exposing themselves to hackers or ransomware attacks. The ATECC608B is a secure element from the Microchip CryptoAuthenticationTM portfolio with advanced Elliptic Curve Cryptography (ECC) capabilities. The Microchip ATECC608B integrates ECDH (Elliptic Curve Diffie Hellman) security protocol an ultra-secure method to provide key agreement for encryption/decryption, along with ECDSA (Elliptic Curve Digital Signature Algorithm) sign-verify authentication for the Internet of Things (IoT) market. Similar to all Microchip CryptoAuthentication products, the new ATECC608A employs ultra-secure hardware-based cryptographic key storage and cryptographic countermeasures which eliminate potential backdoors linked to software weaknesses.
TimesTech Buzz: Recently, I noticed that many manufacturers are emphasizing the IoT security and launched products, such as security IP, architecture, memory, security chips, etc. How do you think we should secure IoT? What are Microchip’s solutions?
Mike Ballard: Microchip has been at the forefront of the Internet of Things since the technologies’ early beginnings more than 10 years ago. Since that time, it has been apparent that security will play a large part, if not a larger role than connectivity in the IoT space. Without proper security, the risks associated with connecting products to the internet could be detrimental to a corporation, not only from a liability or brand recognition standpoint, but also from stock valuation perspective. Our portfolio has incorporated the broadest, most comprehensive security solutions in IoT for many years. This leadership has enabled us to stay ahead of the market through key innovations in cryptography and authentication.
TimesTech Buzz: In view of the shortage of MCU, will chips similar to WIFI+MCU or Bluetooth +MCU be more popular because they can cut peripheral MCU?
Mike Ballard: Integration of certain IoT technologies can bring some benefits, but it also limits flexibility and the need for design engineers to leave overhead for “feature creep.” Nearly every design iteration of a product requires additional features to be added to the product without a complete redesign. Additionally, security requirements are constantly being updated and added (think of how often you have to update your phone or laptop due to new security requirements). Without the flexibility of a larger memory device or additional CPU computing power, the design will not be able to meet these new requirements. These System in Package (SIP) or System on Module (SOM) products typically do not have overhead for additional memory or computing power as they are designed to do one task only. In the case of the current semiconductor shortages, it is a huge mistake to design in a single integrated product that incorporates 2, 3, or 4 silicon chips. If just one of those chips experiences a shortage, then the entire SIP or SOM will experience the same shortage. While a distributed design with separate external devices enables a design engineer to quickly re-layout a board to accommodate another device into their system without a complete redesign.
