Today’s electronic applications require more complex microsystems with performance features that can only be achieved by using the most enhanced and advanced materials and technologies. Hence, packaging technologies used for bonding chips in semiconductors are diversifying and continuing to evolve rapidly. The most commonly used packaging technologies are die bonding or die attach, wafer bonding, and flip chip bonding. Die bonding is fundamental to multiple types of packaging and finds use in photonic integrated circuits, microelectronic hybrid assemblies, sensor packages, and so on.
Wafer bonding allows combining silicon with various dissimilar materials and is used to build microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics, and optoelectronic devices. Flip chips are newer and more advanced products that offer benefits such as high-speed signals, great heat conductivity, and improved electrical performance and find use in a wide range of electronic devices such as integrated circuits, infrared sensors, optical devices, and MEMS, among others.
The semiconductor bonding industry witnesses considerable growth in recent years. The research firm Allied Market Research predicts that the global semiconductor bonding market is set to accrue a sum of $1.2 billion by 2031, thereby exhibiting a CAGR of 3.6% during the forecast period, 2022 – 2031. The growth is attributed to the growing adoption of stacked die technology in the Internet of Things (IoT) devices and the surge in demand for electric and hybrid vehicles in various parts of the world. Moreover, the growing demand for 3D semiconductor assembly and packaging, and the increasing adoption of IoT and AI in the automotive sector are expected to offer prolific growth opportunities for the industry.
Various players in the industry focus on adopting strategies such as new product launches, expansion, and more to gain a competitive edge in the global market and unlock revenue opportunities. For instance, in July 2022, Luminus Devices, Inc, a U.S.-based manufacturer of high-performance LEDs and solid-state light sources introduced the MP-3030-110F flip-chip LEDs which enable the fabrication of efficient lighting solutions. The flip chip mechanism allows for more robust performance and is perfect for horticulture as well as outdoor and harsh lighting environment applications. In October 2022, Promex Industries Inc., a provider of FDA-compliant Class II/III medical device & biotech assemblies, announced the completion of the first phase of its plan to expand its die bonding services.
The new 2200 evo plus die bonder has been established by the firm from BE Semiconductor Industries N.V. adds great capacity, higher accuracy, productivity, and flexibility for projects in various markets. Moreover, the bonder’s optional heated bond head and stage allow for accommodating different types of substrates and materials.
In November 2022, SET Corporation SA, a provider of flexible flip chip bonders unveiled the FC150 PLATINUM for the automotive, defense, telecom, quantum, HPC, AI, and VR markets. The machine is the most recent version of the FC150 and comes with all essential features and 40 years of know-how, with better accuracy than the previous version. Providing both manual and automatic modes, the machine is fabricated for chip-to-chip and chip-to-wafer applications on the same open platform and covers a broad array of applications from low to high forces.
The semiconductor bonding technologies have wide capabilities and allow themselves to be integrated into complex microelectronic circuits. Design laboratories and semiconductor companies are looking forward to using novel technologies for high reliability and better performance of devices. These technologies would inevitably see huge possibilities and growth in the years to come, as they are and will be the prime elements for a majority of electronic devices and systems, catering to numerous applications.
About the author:
Sharmistha Bose has always had a keen interest in reading and writing. An engineering graduate, she forayed into the field of writing due to her love for words and the urge to do something different. Allied Market Research has given her the chance to gain knowledge about different subjects as a Specialist Content Writer. She can be reached at [email protected]
