TE Connectivity Extends SFP-DD I/O Interconnects

Address networking challenges and evolving bandwidth demands with high density and high speed

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SHANGHAI, Aug. 27, 2020 – TE Connectivity (TE) extends its small form-factor pluggable (SFP) product portfolio with new, small form-factor pluggable double density (SFP-DD) products for input/output (I/O) interconnects. The “double density” new cages and surface mount connectors can offer two-channel data transmission, instead of the traditional one-channel in an SFP architecture, which helps data center systems to enable doubled port density with faster data transfer rates.

Compared to SFP28/SFP56 product portfolio, SFP-DD solutions can offer higher density and better signal integrity while freeing up PCB and faceplate space in comparison with QSFP28/QSFP56. SFP-DD connectors feature a two-lane interface and can provide data rates up to 28G NRZ and 56G PAM-4 protocols with a roadmap to 112G PAM-4, up to 56 Gbps or 112 Gbps. Both new cages and connectors are backwards compatible to existing SFP products, which can enable easy upgrades to existing SFP series applications. They can offer system design flexibility, customizable solutions to support thermal management, cable length and stacked configurations. Our SFP-DD interconnect solution can offer superior thermal management with TE’s innovative thermal bridge technology.

“SFP-DD products can offer a compact and efficient interconnection for high-speed I/O data transmission,” said Jimmy Ju, product manager at TE’s Data and Devices business unit. “They can address server challenges generated by underpopulated lanes and evolving bandwidth demands, supporting networking to offer optimal performance by taking advantage of their high density.”

Learn more at www.te.com