33 new fabs started construction in 2022, 28 planned for 2023

Last year the semiconductor industry started building 23 new fabs, reports SEMI, this year it has started building 33 new fabs and next year it will start on another 28.

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Between 2021 and 2023, more than $500 billion will be spent on 84 new volume fabs. “The report underscores the significant impact of government incentives in expanding production capacity and strengthening supply chains,” says SEMI CEO Ajit Manocha.

In the Americas, the U.S. Chips and Science Act has vaulted the region into the lead worldwide in new capital spending as the government investment spawns new chipmaking facilities and supporting supplier ecosystems.

From 2021 through next year, the Americas is forecast to start construction on 18 new facilities. China is expected to outnumber all other regions in new chip manufacturing facilities, with 20 supporting mature technologies planned. Propelled by the European Chips Act, Europe/Mideast investment in new semiconductor facilities is expected to reach a historic high for the region, with 17 new fabs starting construction between 2021 and 2023.

Taiwan is expected to start construction on 14 new facilities, while Japan and Southeast Asia are each projected to begin building six new facilities over the forecast period. Korea is forecast to start construction on three large facilities.