DIGISEQ, Infineon debut certified ring inlay, propelling wearables market


DIGISEQ Ltd, the  wearable payment tech pioneer, has received Mastercard certification for a world-first  pre-certified concentric ring inlay, opening up the market for small independents and  large brands to quickly and effectively launch payment rings within their collections. The inclusion of the ring inlay with integrated secured NFC chip can deliver multiple  services, opening new use cases in addition to payments, such as loyalty, access,  events and hospitality for consumers’ everyday life. 

The market volume for passive payment wearables alone is expected to grow to  US$ 811.4 million by 2028, with the form factor ring growing the fastest at a CAGR of  25.6 percent to US$ 279.6 million. And with these growth projections not taking into  account the recent developments of mobile provisioning and the cost benefits of  DIGISEQ’s pre-certified inlays, it is an exciting time to be launching wearables into  the mainstream market. 

The ultra slim concentric ring inlay is an addition to the full range of pre-certified chip  inlays based on Infineon´s SECORA™ Connect S SLJ37 security solution. It provides support for diverse and innovative product creators with whichever form factor best  suits their product. The inlays are designed to be quickly and simply embedded into a  large range of ring designs and sizes, so that product creators can launch their  unique products at speed with no in-house technical or RF engineering expertise.  This allows them to focus on their own design and marketing of slender rings that  continue to deliver outstanding read range performance even with the smallest ring  sizes. 

The new ring inlay is one of the thinnest in the market. Infineon and DIGISEQ have  been undertaking extensive research and development over the last two years into  the creation of small form factor wearables using Infineon’s SECORA Connect S  SLJ37 chip. This device, available in the ultra-compact USON8-7 surface mount package, measuring just 2×2 mm, makes it ideal for placement on small inlays for incorporation into consumer products without the need for any specialist production  equipment or certifications. The pre-certified ring inlay is available from the manufacturing partner Universal Smart Cards. Rings with inlays will be showcased at  Infineon’s TRUSTECH 2023 booth. 

“The SECORA Connect S solution is especially designed for field-powered wearable  implementation and allows fast and seamless enablement of contactless payments  with passive wearables,” said Tolgahan Yildiz, Vice President Trusted Mobile  Connectivity & Transactions at Infineon. “Our security solution is the basis for this  new pre-certified plug-and-play ring inlay from our Associated Security Network  partner DIGISEQ which can be easily integrated into new sleek product designs. It is  great to see that DIGISEQ has successfully expanded their product portfolio allowing  NFC personalization and tokenization services based on the SECORA Connect  product family.” 

“It’s very exciting to be part of the development of the concentric ring inlay that added  a further form factor to our existing range of ‘SmarTap’ wearables inlays,” said Chris  Allen, Director of Universal Smart Cards at DIGISEQ. “Our range of Mastercard  certified inlays enable brands and OEMs to add contactless payment, provenance  and NFC customer engagement into their product portfolios with ease and at low  cost. The ring inlay pushes these boundaries further; it’s by far our thinnest inlay, and  yet delivers optimum performance for what has become an extremely popular jewelry piece.”