cetecom advanced certifies R&S test solution for hybrid and Next Generation...
The hybrid eCall test specification EN 18052 states that a hybrid system must combine different transmission paths and protocols to make sure an eCall...
Daily News & Analysis
Essential Performance and Real-time Control Without the Baggage
Designers of real-time control applications are increasingly challenged to balance performance and peripheral integration while keeping system cost and complexity low. To address these...
Electric Vehicle Market Size Projected to Reach USD 2.76 Trillion by...
The global electric vehicle (EV) industry is entering a transformative growth phase, driven by ambitious decarbonization targets, substantial investments from automotive manufacturers, advancements in...
Test & Measurement
Automotive
Wireless & Networking
What Factors Are Fueling Rapid Expansion of the LED Chips Market...
The global lighting and semiconductor industries are witnessing a remarkable transformation as demand for energy-efficient technologies continues to rise across residential, commercial, industrial, and...
CEA-Leti Demonstrates MicroLED and OPD Integrated Sensing
CEA-Leti demonstrated a co-packaged microLED and organic photodetector (OPD) architecture that enables optical sensing functions. This solution paves the way to integrate sensing capabilities...
NextPower Enters BESS and AI Data Center Markets with Prevalon Energy...
Nextpower, a leading provider of solar and power technology solutions for utility-scale power plants, announced it has entered into a definitive agreement to acquire...
ST new GaN semiconductors improve energy efficiency for high-demand applications from...
New gallium nitride (GaN)-based power semiconductors from STMicroelectronics are designed to improve efficiency and increase power density in high-demand applications that support electrification. The...
TimesTech TV
Exclusive conversation of Electronics Buzz with Kevin Brennan at EP India 2026.
07:32
Exclusive interaction with Senthil Nagaraj, Sales Manager for India at Indium, during EP India 2026.
05:49
Building India’s Own Chips 🇮🇳 | Mindgrove's Co-Founder & CEO on RISC-V, IoT & Vision SoCs
12:20
Next-Gen IoT & Smart Tech | Silicon Labs at @epIndiaofficial 2026
07:54
Inside Smart Factories & Industry 4.0 | Panasonic at @epIndiaofficial 2026
07:49
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Bondada Group CMD on Why Fiberization Is India’s Digital Backbone
In an interview with TimesTech, Dr Bondada Raghavendra Rao, Chairman & Managing Director, Bondada Group, discusses why fiberization is becoming the backbone of India’s...
LAPP India Bets on Smart Connectivity for Industry Growth
In an interview with TimesTech, Uphar Srivastava – Vice President of LAPP India, highlighted LAPP India’s transformation from a cable manufacturer into a comprehensive connectivity...
Edge AI and Semiconductors Key to India’s AI Future
In an interview with TimesTech, Abhishek Agarwal, President – Judge India & Global Delivery at The Judge Group, spoke about why Edge AI and...
iThink Logistics Cuts RTOs, Scales to ₹100 Cr Bootstrapped
In an interview with TimesTech, Zaiba Sarang, Co-founder of iThink Logistics, spoke about how the company is helping D2C brands reduce RTO rates through...
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Vi expands 5G footprint in West Bengal; plans to launch services across 10 cities
Following its 5G launch in Kolkata and Siliguri last year, leading telecom operator Vi is now strengthening its 5G footprint across multiple cities in...
Powered by Silicon Labs, Comminent Ships 500,000 Wi-SUN Modules
Comminent, an innovator in next-generation IoT communication network platforms, and Silicon Labs, the leading innovator in low-power wireless, announced a major milestone for India's...
R&S strengthens its in-vehicle networks test portfolio with the launch of new ASA-ML compliance...
The Automotive SerDes Alliance (ASA) was formed in 2019 with the ambition of providing an open standard for a multi-vendor ecosystem for high-speed asymmetric...
ETH WIZ 3 Click Delivers Ethernet Connectivity with Dual-Core Processing and Hardware TCP/IP Networking
ETH WIZ 3 Click is a new Ethernet interface Click board from MIKROE, the embedded solutions company that dramatically cuts development time by providing innovative hardware and software...
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IoT Industry Expansion Fueled by Cloud Computing, AI, and Connected Devices
According to a new report published by Allied Market Research, the IoT market size was valued at $1,425.48 billion in 2024 and is estimated...
New MediaTek Genio 360 GenAI Capable IoT Platform for Smart, Industrial, Robotics, and IoT...
Mouser Electronics, the authorized global distributor with the newest electronic components and industrial automation products, is now shipping the new Genio 360 GenAI-capable IoT platform...
How Industrial IoT is Transforming Smart Manufacturing and Real Time Data Monitoring in 2026
The manufacturing sector is undergoing a major digital transformation in 2026. Companies are adopting advanced technologies to improve productivity, reduce costs, and respond faster...
How Micro Fuel Cells Are Revolutionizing Portable Electronics and IoT Devices
The rapid evolution of portable electronics and Internet of Things (IoT) devices has created an urgent demand for compact, long-lasting, and efficient energy solutions. Traditional batteries,...
Cloud & Data
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NextPower Enters BESS and AI Data Center Markets with Prevalon Energy Acquisition
Nextpower, a leading provider of solar and power technology solutions for utility-scale power plants, announced it has entered into a definitive agreement to acquire...
Data Centers Enter the AI Era as Global Market Size to Surpass USD 1.10...
The global data center industry is entering a transformative decade, fueled by explosive demand for artificial intelligence (AI), cloud computing, edge infrastructure, and digital...
Data Center Power Market to Hit $20.48 Billion by 2032 as AI Data Centers...
The global Data Center Power Market is witnessing strong momentum as hyperscale computing, artificial intelligence (AI), cloud infrastructure, and digital transformation initiatives continue accelerating...
Microchip Launches 3.3 kV mSiC Power Modules for AI Data Centers
Microchip Technology, announces the availability of its new 3.3 kV HV‑D3 mSiC Power Modules, designed to simplify and accelerate the adoption of solid-state transformers (SSTs) in...
